The thermal conductivity of copper alloy is as high as 330W/m·k, ensuring that the nozzle is heated more evenly. The volume is twice as large as ordinary nozzles, supporting high-speed printing speed of 600mm/s. The nickel-plated layer on the surface greatly reduce the adhesion of filaments to the nozzle and smoother extrusion. *Applicable to most FDM materials such as PLA, ABS, PETG, TPE, TPU, PC, etc., And PEEK, PEKK, PEI, PSU, PPSU and other high temperature filaments. Ensure fast heating of the high-temperature filaments and continuous printing * Copper alloy high temperature resistance up to 500°, hardened steel high temperature resistance up to 450°