Specifications
Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.
Product Information
SKU
179879
Mfr Part#
HSC67-6G
UPC
697429014079
General Specifications
Material
Silicona/Oxide Metal
Viscosity
542000 mPa.s
Thermal Conductivity
0.67 W/mK
Specific Gravity
2.1 g/cm3
Shelf Life
60 months from DOM
Size
6 grams
Quantity
1
What's in the Box
What's in the Box
Heat Sink Compound x1